APA (7th ed.) Citation

Liew, P. J., Wong, K. Y., Lau, K. T., & Jingsi, W. (2020). Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology. Penerbit UTeM.

Chicago Style (17th ed.) Citation

Liew, Pay Jun, Kah Yan Wong, Kok Tee Lau, and Wang Jingsi. Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology. Penerbit UTeM, 2020.

MLA (9th ed.) Citation

Liew, Pay Jun, et al. Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology. Penerbit UTeM, 2020.