APA (7th ed.) Citation

Omar, G., Esa, S. R., Sheikh Md Fadzullah, S. H., Siow, K. S., Abdul Rahim, B., & Cosut, B. (2020). Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology. Universiti Malaysia Perlis.

Chicago Style (17th ed.) Citation

Omar, Ghazali, Siti Rahmah Esa, Siti Hajar Sheikh Md Fadzullah, Kim Shyong Siow, Bazura Abdul Rahim, and Bunyemin Cosut. Diffusion Mechanism of Silver Particles in Polymer Binder for Die Attach Interconnect Technology. Universiti Malaysia Perlis, 2020.

MLA (9th ed.) Citation

Omar, Ghazali, et al. Diffusion Mechanism of Silver Particles in Polymer Binder for Die Attach Interconnect Technology. Universiti Malaysia Perlis, 2020.