Jingsi, W., Liew, P. J., & Jiaqi, Z. (2019). Material removal in ultrasonic abrasive polishing of additive manufactured components. MDPI AG.
Chicago Style (17th ed.) CitationJingsi, Wang, Pay Jun Liew, and Zhu Jiaqi. Material Removal in Ultrasonic Abrasive Polishing of Additive Manufactured Components. MDPI AG, 2019.
MLA (9th ed.) CitationJingsi, Wang, et al. Material Removal in Ultrasonic Abrasive Polishing of Additive Manufactured Components. MDPI AG, 2019.
Warning: These citations may not always be 100% accurate.
