Ali Mokhtar, M. N., Abdullah, M. Z., Saad, A. A., Che Ani, F., & Samsudin, Z. (2018). Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Penerbit Universiti Teknikal Malaysia Melaka.
Chicago Style (17th ed.) CitationAli Mokhtar, Mohd Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Fakhrozi Che Ani, and Zambri Samsudin. Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Penerbit Universiti Teknikal Malaysia Melaka, 2018.
MLA (9th ed.) CitationAli Mokhtar, Mohd Najib, et al. Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Penerbit Universiti Teknikal Malaysia Melaka, 2018.
Warning: These citations may not always be 100% accurate.