Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip
Cu-A1 intermetallic compound (IMC) in Cu wire-A1 bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Conference or Workshop Item |
| Language: | en |
| Published: |
2012
|
| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/20186/1/XRD%20ANALYSIS%20OF%20CU-AI%20INTERCONNECT%20INTERMETALLIC%20COMPOUND%20IN%20AN%20ANNEALED%20MICRO-CHIP-KOK%20YAU%20CHUA-MAK%2000353%20RAF.pdf http://eprints.utem.edu.my/id/eprint/20186/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1832717445606932480 |
|---|---|
| author | Thangaraj, Joseph Sahaya Anand Chua, Kok Yau Hng, May Ting Lee, Cher Chia |
| author_facet | Thangaraj, Joseph Sahaya Anand Chua, Kok Yau Hng, May Ting Lee, Cher Chia |
| author_sort | Thangaraj, Joseph Sahaya Anand |
| building | UTEM Library |
| collection | Institutional Repository |
| content_provider | Universiti Teknikal Malaysia Melaka |
| content_source | UTEM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | Cu-A1 intermetallic compound (IMC) in Cu wire-A1 bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction (XRD) technique to identify the IMC in the Cu wired micro-chip samples in powder form. Existence of mixture of CuA1 and CuA12 was first confirmed by transmission electron microscope (TEM) and energy dispersive X-ray (EDX). In XRD analysis, peak correspond to CuA1 phase is identified from measurement with slower scan configurarion. The difficulty for IMC peak detection in diffractogram is due to low composition ratio of IMC relative to other materials available in the sample. KOH treatment for enhancing IMC peaks intensity does not work as expected as it etches the IMC as well. |
| format | Conference or Workshop Item |
| id | my.utem.eprints-20186 |
| institution | Universiti Teknikal Malaysia Melaka |
| language | en |
| publishDate | 2012 |
| record_format | eprints |
| spelling | my.utem.eprints-201862023-05-25T11:10:05Z http://eprints.utem.edu.my/id/eprint/20186/ Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip Thangaraj, Joseph Sahaya Anand Chua, Kok Yau Hng, May Ting Lee, Cher Chia T Technology (General) TA Engineering (General). Civil engineering (General) Cu-A1 intermetallic compound (IMC) in Cu wire-A1 bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction (XRD) technique to identify the IMC in the Cu wired micro-chip samples in powder form. Existence of mixture of CuA1 and CuA12 was first confirmed by transmission electron microscope (TEM) and energy dispersive X-ray (EDX). In XRD analysis, peak correspond to CuA1 phase is identified from measurement with slower scan configurarion. The difficulty for IMC peak detection in diffractogram is due to low composition ratio of IMC relative to other materials available in the sample. KOH treatment for enhancing IMC peaks intensity does not work as expected as it etches the IMC as well. 2012 Conference or Workshop Item PeerReviewed text en http://eprints.utem.edu.my/id/eprint/20186/1/XRD%20ANALYSIS%20OF%20CU-AI%20INTERCONNECT%20INTERMETALLIC%20COMPOUND%20IN%20AN%20ANNEALED%20MICRO-CHIP-KOK%20YAU%20CHUA-MAK%2000353%20RAF.pdf Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip. In: International Conference on X-Rays & Related Techniques in Research & Industry 2012 (ICXRI 2012) , 3-5 Julai 2012, Vistana Hotel, Pulau Pinang. |
| spellingShingle | T Technology (General) TA Engineering (General). Civil engineering (General) Thangaraj, Joseph Sahaya Anand Chua, Kok Yau Hng, May Ting Lee, Cher Chia Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip |
| title | Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip |
| title_full | Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip |
| title_fullStr | Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip |
| title_full_unstemmed | Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip |
| title_short | Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip |
| title_sort | xrd analysis of cu-ai interconnerct intermetallic compound in an annealed micro-chip |
| topic | T Technology (General) TA Engineering (General). Civil engineering (General) |
| url | http://eprints.utem.edu.my/id/eprint/20186/1/XRD%20ANALYSIS%20OF%20CU-AI%20INTERCONNECT%20INTERMETALLIC%20COMPOUND%20IN%20AN%20ANNEALED%20MICRO-CHIP-KOK%20YAU%20CHUA-MAK%2000353%20RAF.pdf http://eprints.utem.edu.my/id/eprint/20186/ |
| url_provider | http://eprints.utem.edu.my/ |