Thermal Analysis of Staggered Pin Fin Heat Sink for Central Processing Unit

The advancement of microelectronics technology in producing high clock speed and power density’s central processor unit (CPU) indirectly related to thermal management issue. This is a major challenge to the manufacturers, designers and researchers to find the optimum design of the cooling system. If...

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Bibliographic Details

Main Authors:	Mohd Annuar, Khalil Azha, Mohd Ab Halim, Mohd Firdaus, Ismail, Fatimah Sham, Madiha , Zahari, Siti Halma, Johari, Harun, Mohamad Haniff
Format:	Article
Language:	en
Published:	2015
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.utem.edu.my/id/eprint/17131/1/68-73.pdf http://eprints.utem.edu.my/id/eprint/17131/
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