Thermal Performance Of Pin Fin Arrangement Of Heat Sink Design For Electronic Central Processing Unit
Central Processing Unit (CPU) has high capability and powerful in processing data at the higher speed is a brain of the computer system. With increasingly the functionality, design complexity and the compactness of the CPU’s system, thermal problem becomes an important issue. This problem has signif...
Saved in:
| Main Authors: | , |
|---|---|
| Format: | Conference or Workshop Item |
| Language: | en |
| Published: |
2014
|
| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/11797/1/PAPER_Thermal_Performance_ver_2.1.pdf http://eprints.utem.edu.my/id/eprint/11797/ http://www.cairo.utm.my/cairo/index.php/component/content/article/13-events/92-mini-symposium |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | Central Processing Unit (CPU) has high capability and powerful in processing data at the higher speed is a brain of the computer system. With increasingly the functionality, design complexity and the compactness of the CPU’s system, thermal problem becomes an important issue. This problem has significantly reduced the performance and lifetime of the components. Thus, to control and minimize the temperature of this electronic package especially for laptop, notebook etc, the conventional external heat sink has been used widely. Various type of heat sink with different shape, dimension and material has been designed in order to improve the heat transfer process and at the same time can maintain the CPU’s performance. In this paper, 3D simulation heat sink was designed by using COMSOL multiphysics software package. The simulation was carried out for various arrangements of pin fins heat sinks such as inline, staggered and random position. The simulation results have proposed a new arrangement of pin fin that able to give better thermal performance compared to the conventional design. |
|---|