Silver Spot Plating Technique.
Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bond...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Conference or Workshop Item |
| Language: | en |
| Published: |
2005
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/9773/1/Silver_Spot_Plating_Technique_%28PPKKimia%29_2005.pdf http://eprints.usm.my/9773/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1834437104687382528 |
|---|---|
| author | Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. |
| author_facet | Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. |
| author_sort | Siah, C.H. |
| building | Hamzah Sendut Library |
| collection | Institutional Repository |
| content_provider | Universiti Sains Malaysia |
| content_source | USM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using
electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process.
|
| format | Conference or Workshop Item |
| id | my.usm.eprints.9773 |
| institution | Universiti Sains Malaysia |
| language | en |
| publishDate | 2005 |
| record_format | eprints |
| spelling | my.usm.eprints.9773 http://eprints.usm.my/9773/ Silver Spot Plating Technique. Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. TP1-1185 Chemical technology Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process. 2005-01 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.usm.my/9773/1/Silver_Spot_Plating_Technique_%28PPKKimia%29_2005.pdf Siah, C.H. and Aziz, N. and Samad, Z and Idris, M. N. and Miskam, M.A. (2005) Silver Spot Plating Technique. In: Proceedings of the 4" Mechanical Engineering Research Colloquium (MERC 200511), 27-29 January 2005, School of Mechanical Engineering, USM, Penang, Malaysia. |
| spellingShingle | TP1-1185 Chemical technology Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. Silver Spot Plating Technique. |
| title | Silver Spot Plating Technique. |
| title_full | Silver Spot Plating Technique. |
| title_fullStr | Silver Spot Plating Technique. |
| title_full_unstemmed | Silver Spot Plating Technique. |
| title_short | Silver Spot Plating Technique. |
| title_sort | silver spot plating technique. |
| topic | TP1-1185 Chemical technology |
| url | http://eprints.usm.my/9773/1/Silver_Spot_Plating_Technique_%28PPKKimia%29_2005.pdf http://eprints.usm.my/9773/ |
| url_provider | http://eprints.usm.my/ |