Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter...
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| Format: | Thesis |
| Language: | en |
| Published: |
2006
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| Online Access: | http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf http://eprints.usm.my/9178/ |
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| _version_ | 1834436966382305280 |
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| author | Abdullah, Muhammad Khalil |
| author_facet | Abdullah, Muhammad Khalil |
| author_sort | Abdullah, Muhammad Khalil |
| building | Hamzah Sendut Library |
| collection | Institutional Repository |
| content_provider | Universiti Sains Malaysia |
| content_source | USM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi.
Nowadays, microelectronic devices become more compact, lighter in weight and more functional, including Stacked-Chip Scale Package (S-CSP). It is a technology which has high density packaging options.
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| format | Thesis |
| id | my.usm.eprints.9178 |
| institution | Universiti Sains Malaysia |
| language | en |
| publishDate | 2006 |
| record_format | eprints |
| spelling | my.usm.eprints.9178 http://eprints.usm.my/9178/ Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. Abdullah, Muhammad Khalil TK7885-7895 Computer engineering. Computer hardware Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter in weight and more functional, including Stacked-Chip Scale Package (S-CSP). It is a technology which has high density packaging options. 2006-06 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf Abdullah, Muhammad Khalil (2006) Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. Masters thesis, Universiti Sains Malaysia. |
| spellingShingle | TK7885-7895 Computer engineering. Computer hardware Abdullah, Muhammad Khalil Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title | Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_full | Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_fullStr | Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_full_unstemmed | Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_short | Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_sort | modelling and analysis of stacked-chip scale packages (s-csps) encapsulation process using finite difference method [tk7874. k46 2007 f rb]. |
| topic | TK7885-7895 Computer engineering. Computer hardware |
| url | http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf http://eprints.usm.my/9178/ |
| url_provider | http://eprints.usm.my/ |