Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) tela...
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| Format: | Thesis |
| Language: | en |
| Published: |
2015
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| Online Access: | http://eprints.usm.my/30367/1/Thesis_%28Tan_Kim_Seah%29.pdf http://eprints.usm.my/30367/ |
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| _version_ | 1834499419145240576 |
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| author | Tan , Kim Seah |
| author_facet | Tan , Kim Seah |
| author_sort | Tan , Kim Seah |
| building | Hamzah Sendut Library |
| collection | Institutional Repository |
| content_provider | Universiti Sains Malaysia |
| content_source | USM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan
mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin,
terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan
lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) telah
ditambahkan ke dalam nano-pes Ag-Cu, diikuti oleh pensinteran di udara terbuka
pada suhu 380°C selama 30 min tanpa bantuan tekanan luar, untuk mengkaji kesan
terhadap sifat-sifat fizikal, elektrikal, terma dan mekanikal.
A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu
nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol)
which is meant for high-temperature die-attach applications has been developed.
Various weight percent of Cu nanoparticles (20-80 wt%) has been loaded into the
Ag-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30
min without the need of applied external pressure. |
| format | Thesis |
| id | my.usm.eprints.30367 |
| institution | Universiti Sains Malaysia |
| language | en |
| publishDate | 2015 |
| record_format | eprints |
| spelling | my.usm.eprints.30367 http://eprints.usm.my/30367/ Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications Tan , Kim Seah TN1-997 Mining engineering. Metallurgy Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) telah ditambahkan ke dalam nano-pes Ag-Cu, diikuti oleh pensinteran di udara terbuka pada suhu 380°C selama 30 min tanpa bantuan tekanan luar, untuk mengkaji kesan terhadap sifat-sifat fizikal, elektrikal, terma dan mekanikal. A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol) which is meant for high-temperature die-attach applications has been developed. Various weight percent of Cu nanoparticles (20-80 wt%) has been loaded into the Ag-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30 min without the need of applied external pressure. 2015-01 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/30367/1/Thesis_%28Tan_Kim_Seah%29.pdf Tan , Kim Seah (2015) Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications. PhD thesis, Universiti Sains Malaysia. |
| spellingShingle | TN1-997 Mining engineering. Metallurgy Tan , Kim Seah Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications |
| title | Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_full | Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_fullStr | Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_full_unstemmed | Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_short | Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_sort | investigations on silver-copper
nanopaste as die-attach material for
high temperature applications |
| topic | TN1-997 Mining engineering. Metallurgy |
| url | http://eprints.usm.my/30367/1/Thesis_%28Tan_Kim_Seah%29.pdf http://eprints.usm.my/30367/ |
| url_provider | http://eprints.usm.my/ |