Properties Of Epoxy/Silica Thin Film Composite For Electronic Application.
In line with the miniaturization trends of the product designs in electronic industry, conventional packaging technology has been replaced.
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | en |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://eprints.usm.my/20364/1/TUE-SE08-05.pdf http://eprints.usm.my/20364/ |
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| _version_ | 1834496917423259648 |
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| author | M, Mariatti Foo,, Y.L. A, Azizan Sim, L.C. |
| author_facet | M, Mariatti Foo,, Y.L. A, Azizan Sim, L.C. |
| author_sort | M, Mariatti |
| building | Hamzah Sendut Library |
| collection | Institutional Repository |
| content_provider | Universiti Sains Malaysia |
| content_source | USM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | In line with the miniaturization trends of the product designs in electronic industry, conventional packaging technology has been replaced. |
| format | Conference or Workshop Item |
| id | my.usm.eprints.20364 |
| institution | Universiti Sains Malaysia |
| language | en |
| publishDate | 2010 |
| record_format | eprints |
| spelling | my.usm.eprints.20364 http://eprints.usm.my/20364/ Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. M, Mariatti Foo,, Y.L. A, Azizan Sim, L.C. TN1-997 Mining engineering. Metallurgy In line with the miniaturization trends of the product designs in electronic industry, conventional packaging technology has been replaced. 2010-11 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.usm.my/20364/1/TUE-SE08-05.pdf M, Mariatti and Foo,, Y.L. and A, Azizan and Sim, L.C. (2010) Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. In: 7th Asian Australian Conference on Composite Materials”, 15-18 November 2010 , Taipei,Taiwan . |
| spellingShingle | TN1-997 Mining engineering. Metallurgy M, Mariatti Foo,, Y.L. A, Azizan Sim, L.C. Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. |
| title | Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. |
| title_full | Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. |
| title_fullStr | Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. |
| title_full_unstemmed | Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. |
| title_short | Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. |
| title_sort | properties of epoxy/silica thin film composite for electronic application. |
| topic | TN1-997 Mining engineering. Metallurgy |
| url | http://eprints.usm.my/20364/1/TUE-SE08-05.pdf http://eprints.usm.my/20364/ |
| url_provider | http://eprints.usm.my/ |