3D printed substrates for the design of compact RF systems

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Bibliographic Details
Main Authors:	Mohd Ghazali M.I., Mondal S., Karuppuswami S., Chahal P.
Other Authors:	Faculty of Engineering and Built Environment
Format:	conference output::conference proceedings::conference paper
Language:	English en_US
Published:	Institute of Electrical and Electronics Engineers Inc. 2024
Subjects:	3D printing 5G Compact systems Electronics packaging Chip scale packages Cost effectiveness Microstrip antennas Network components Slot antennas Substrates 3-D printing Amplifier circuits Compact system Integrated packages LEGO-like assembly Packaging solutions Patterning process Printed substrate 3D printers
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