3D Printed high functional density packaging compatible out-of-plane antennas

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Bibliographic Details
Main Authors:	Ghazali, MIM, Karuppuswami, S, Kaur, A, Chahal, P
Format:	Article
Language:	English en_US
Published:	Elsevier 2024
Subjects:	Additive manufacturing Air-gap antenna High-density integration Packaging Polyjet printing RF on-chip antenna Vertical yagi-uda antenna
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