3D Printed Substrates for the Design of Compact RF Systems

In this paper, Additive Manufacturing (AM) using 3D printing has been shown as a potential candidate for realizing customized compact solutions for RF packaging applications. Cost effective 3D printing based packaging solutions with customized substrates and air gaps allow easier integration of mult...

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Bibliographic Details

Main Authors:	Ghazalil, MIM, Mondal, S, Karuppuswami, S, Chahal, P
Format:	Proceedings Paper
Language:	English en_US
Published:	IEEE 2024
Subjects:	3D printing 5G Compact systems Electronics packaging
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