YIG thick film as substrate overlay for bandwidth enhancement of microstrip patch antenna

Research on microstrip patch antenna (MPA) has been growing in the past few decades due to its planar profile and easy fabrication. Its simplicity of structure, which includes a conductive patch, a dielectric substrate, a ground plane, and a microstrip feeder, is making it more popular for integrati...

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Bibliographic Details

Main Authors:	Hasan, Intan Helina, Hamidon, Mohd Nizar, Ismail, Alyani, Ismail, Ismayadi, Mekki, Anwer Sabah, Mohd Kusaimi, Muhammad Asnawi, Azhari, Saman, Osman, Rosiah
Format:	Article
Language:	en
Published:	Institute of Electrical and Electronics Engineers 2018
Online Access:	http://psasir.upm.edu.my/id/eprint/74457/1/YIG_Thick_Film_as_Substrate_Overlay_for_Bandwidth_Enhancement_of_Microstrip_Patch_Antenna.pdf http://psasir.upm.edu.my/id/eprint/74457/ https://ieeexplore.ieee.org/document/8370636
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