Bismuth addition in Sn-Ag-Cu lead-free solder
Sn-Ag-Cu solder is a form of solder to replace Sn-Pb solder in electronic device soldering. Sn-Ag-Cu however, consists of various weaknesses when compared to traditional Sn-Pb solder in terms of mechanical properties and reliability. Alloying with elements such as bismuth, can be one of the methods...
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| Main Authors: | , , |
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| Format: | Book Section |
| Language: | en |
| Published: |
Faculty of Engineering, Universiti Putra Malaysia
2024
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| Online Access: | http://psasir.upm.edu.my/id/eprint/116512/1/116512.pdf http://psasir.upm.edu.my/id/eprint/116512/ https://spel3.upm.edu.my/max/dokumen/ICAEMC2024_Advanced_Engineering_Materials_and_Composites_ICAEMC_2024_compressed.pdf |
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| Summary: | Sn-Ag-Cu solder is a form of solder to replace Sn-Pb solder in electronic device soldering. Sn-Ag-Cu however, consists of various weaknesses when compared to traditional Sn-Pb
solder in terms of mechanical properties and reliability. Alloying with elements such as bismuth, can be one of the methods to improve the solder properties. Therefore, a short review is carried out to understand the improved performance with bismuth doping in the solder melting temperature and reliability testing. |
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