Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging
This paper studies how isothermal aging affects the micromechanical and structural properties of mixed solder joints made of 60Sn-40Pb (SnPb) with Sn-3.0Ag-0.5Cu (SAC305) and SnPb with Sn-0.7Cu (SnCu). The nanoindentation test was done to measure the micromechanical properties of SnPb/SAC305 and SnP...
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Taylor and Francis Ltd.
2025
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| author | Zulkifli M.N. Abdullah I. Azhan N.H. Jalar A. |
| author2 | 36703431600 |
| author_facet | 36703431600 Zulkifli M.N. Abdullah I. Azhan N.H. Jalar A. |
| author_sort | Zulkifli M.N. |
| building | UNITEN Library |
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| content_provider | Universiti Tenaga Nasional |
| content_source | UNITEN Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | This paper studies how isothermal aging affects the micromechanical and structural properties of mixed solder joints made of 60Sn-40Pb (SnPb) with Sn-3.0Ag-0.5Cu (SAC305) and SnPb with Sn-0.7Cu (SnCu). The nanoindentation test was done to measure the micromechanical properties of SnPb/SAC305 and SnPb/SnCu mixed solder joints. These properties are hardness, reduced modulus, and stress exponent. Scanning electron microscopy (SEM) was used to look at the microstructure of a cross-section of mixed solder joints. The micrographs that were taken were then examined with open-source image processing software called ImageJ. It was found that the rate and distribution of intermetallic compound (IMC) formation and the reduction of Sn-rich phase grain size affect how the hardness and stress exponent values of mixed solder joints change after 1000 h of high temperature storage (HTS). ImageJ analysis shows that the Pb-rich phase particle count and distribution can be used to figure out how mixed solder joints respond to indentation creep and how that relates to isothermal aging. Using ImageJ, it?s clear that the indentation creep behavior of the GBS mechanism of an as soldered SnPb/SnCu mixed solder joint is caused by the highest number and size of Pb-rich phase particles that are not well distributed across the dendritic area of Sn-rich phase grain boundaries. ? 2024 Informa UK Limited, trading as Taylor & Francis Group. |
| format | Article |
| id | my.uniten.dspace-37106 |
| institution | Universiti Tenaga Nasional |
| publishDate | 2025 |
| publisher | Taylor and Francis Ltd. |
| record_format | dspace |
| spelling | my.uniten.dspace-371062025-03-03T15:47:33Z Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging Zulkifli M.N. Abdullah I. Azhan N.H. Jalar A. 36703431600 57224607172 56652239100 11539926200 Binary alloys Copper alloys Creep Grain boundaries Hardness Isotherms Lead alloys Lead-free solders Microstructure Open source software Particle size analysis Scanning electron microscopy Silver alloys Ternary alloys Tin alloys Imagej Isothermal ageing Micro-mechanical Mixed solder joint Nano indentation Phase grains Phase particles Rich phase Solder joints Stress exponents Nanoindentation This paper studies how isothermal aging affects the micromechanical and structural properties of mixed solder joints made of 60Sn-40Pb (SnPb) with Sn-3.0Ag-0.5Cu (SAC305) and SnPb with Sn-0.7Cu (SnCu). The nanoindentation test was done to measure the micromechanical properties of SnPb/SAC305 and SnPb/SnCu mixed solder joints. These properties are hardness, reduced modulus, and stress exponent. Scanning electron microscopy (SEM) was used to look at the microstructure of a cross-section of mixed solder joints. The micrographs that were taken were then examined with open-source image processing software called ImageJ. It was found that the rate and distribution of intermetallic compound (IMC) formation and the reduction of Sn-rich phase grain size affect how the hardness and stress exponent values of mixed solder joints change after 1000 h of high temperature storage (HTS). ImageJ analysis shows that the Pb-rich phase particle count and distribution can be used to figure out how mixed solder joints respond to indentation creep and how that relates to isothermal aging. Using ImageJ, it?s clear that the indentation creep behavior of the GBS mechanism of an as soldered SnPb/SnCu mixed solder joint is caused by the highest number and size of Pb-rich phase particles that are not well distributed across the dendritic area of Sn-rich phase grain boundaries. ? 2024 Informa UK Limited, trading as Taylor & Francis Group. Final 2025-03-03T07:47:33Z 2025-03-03T07:47:33Z 2024 Article 10.1080/01694243.2024.2356962 2-s2.0-85193970262 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85193970262&doi=10.1080%2f01694243.2024.2356962&partnerID=40&md5=8024b795cb3c3419cc5b1139d9d501a4 https://irepository.uniten.edu.my/handle/123456789/37106 38 20 3842 3859 Taylor and Francis Ltd. Scopus |
| spellingShingle | Binary alloys Copper alloys Creep Grain boundaries Hardness Isotherms Lead alloys Lead-free solders Microstructure Open source software Particle size analysis Scanning electron microscopy Silver alloys Ternary alloys Tin alloys Imagej Isothermal ageing Micro-mechanical Mixed solder joint Nano indentation Phase grains Phase particles Rich phase Solder joints Stress exponents Nanoindentation Zulkifli M.N. Abdullah I. Azhan N.H. Jalar A. Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging |
| title | Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging |
| title_full | Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging |
| title_fullStr | Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging |
| title_full_unstemmed | Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging |
| title_short | Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging |
| title_sort | micromechanical and microstructure evolution of leaded (snpb) and lead-free (sac305 and sncu) mixed solder joints during isothermal aging |
| topic | Binary alloys Copper alloys Creep Grain boundaries Hardness Isotherms Lead alloys Lead-free solders Microstructure Open source software Particle size analysis Scanning electron microscopy Silver alloys Ternary alloys Tin alloys Imagej Isothermal ageing Micro-mechanical Mixed solder joint Nano indentation Phase grains Phase particles Rich phase Solder joints Stress exponents Nanoindentation |
| url_provider | http://dspace.uniten.edu.my/ |