Numerical Analysis on Heat Sinks with Different Geometries for PC Cooling System
A heat sink is a device that removes heat from electronic devices that consume electricity. This heat removal is required to meet the equipment's design requirements. In this paper, different heat sink geometries are designed and simulated using computational fluids dynamic software to compare...
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| Format: | Conference paper |
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American Institute of Physics
2025
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| Summary: | A heat sink is a device that removes heat from electronic devices that consume electricity. This heat removal is required to meet the equipment's design requirements. In this paper, different heat sink geometries are designed and simulated using computational fluids dynamic software to compare the temperature distribution and thermal performance. The main objective is to investigate the effect of the fin arrangement, base plate thickness and type of heat sink material on the thermal performance of heat sinks using the Ansys FLUENT 2021. The heat sinks have been analyzed at different heat load supply of 60 W, 70 W and 80 W. Three different fins arrangement of rectangular plates, rectangular pins and separated short plates heat sink are compared of the thermal performance in this study. The effects of heat sink materials on thermal performance were also investigated numerically. In this research work, thermal resistance is the parameter that determines the thermal performance of the heat sinks. The findings revealed that the thermal resistance is lower for the copper rectangular plates heat sink with 5 mm base plate thickness. ? 2024 American Institute of Physics Inc.. All rights reserved. |
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