3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process

Purpose: Die edge quality with its corresponding die strength are two important factors for excellent dicing quality especially for low-k wafers due to their weak mechanical properties and fragile structures. It is shown in past literatures that laser dicing or grooving does yield good dicing qualit...

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Bibliographic Details

Main Authors:	Mohammad Nazri M.H., Yong T.C., Yusof F.B., Soon How Thien G., Yoong C.K., Kar Y.B.
Other Authors:	59150751800
Format:	Article
Published:	Emerald Publishing 2025
Subjects:	Dies Heat treatment Neodymium lasers Ultraviolet lasers Yttrium aluminum garnet (back end of line) BEOL Back end of lines Data groups Die strength Heat affecting zone Heat-treatment process Laser grooving Scanning electron microscopy Strength characterization Three point bend tests
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