APA (7th ed.) Citation

M.H, M. N., T.C, Y., F.B, Y., G, S. H. T., C.K, Y., Y.B, K., & 59150751800. (2025). 3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process. Emerald Publishing.

Chicago Style (17th ed.) Citation

M.H, Mohammad Nazri, Yong T.C, Yusof F.B, Soon How Thien G, Yoong C.K, Kar Y.B, and 59150751800. 3-pass and 5-pass Laser Grooving & Die Strength Characterization for Reinforced Internal Low-k 55nm Node Wafer Structure via Heat-treatment Process. Emerald Publishing, 2025.

MLA (9th ed.) Citation

M.H, Mohammad Nazri, et al. 3-pass and 5-pass Laser Grooving & Die Strength Characterization for Reinforced Internal Low-k 55nm Node Wafer Structure via Heat-treatment Process. Emerald Publishing, 2025.