Improvement of cu-al bond integrity on low k pad structures
TS270.O54 2011
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| Format: | text::Final Year Project |
| Language: | en |
| Published: |
2024
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| _version_ | 1838234415974580224 |
|---|---|
| author | Ooi Xin Yi |
| author_facet | Ooi Xin Yi |
| author_sort | Ooi Xin Yi |
| building | UNITEN Library |
| collection | Institutional Repository |
| content_provider | Universiti Tenaga Nasional |
| content_source | UNITEN Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | TS270.O54 2011 |
| format | Resource Types::text::Final Year Project |
| id | my.uniten.dspace-35331 |
| institution | Universiti Tenaga Nasional |
| language | en |
| publishDate | 2024 |
| record_format | dspace |
| spelling | my.uniten.dspace-353312025-07-16T11:05:19Z Improvement of cu-al bond integrity on low k pad structures Ooi Xin Yi Copper wire TS270.O54 2011 Since 1950's, Gold wire-bonding has been introduced into the field of interconnection of ICs and it becomes the main interconnection process in the semiconductor packaging industry. Gold wires are commonly used for wire-bonding and it fits well the industrial requirements. However, the price of Gold wires increasing significantly, Copper wires is a potential replacement for Gold due to their superior electrical and mechanical properties. In general, Cu-Al intermetallics have better electrical and thermal qualities than Cu-Al intermetallics. In order to incorporate Cu in the wire- bonding process, substantial data regarding aging and intermetallic formation of Cu- Al bonds is required and the results are compared with Au samples. In this study, the bond integrity and thermal aging of Cu-Al and Au-Al wire-bonds were investigated. The Copper and Gold wire-bonds samples were heat-treated at 175°C for 168, 504 and 1008 hours while at temperature of 225°C for 4.5, 13.5, 26, 52 and 97 hours respectively. The intermetallics of the wire-bonds, and in particular the Al-Cu interface, were studied. Discontinuous and non-uniform of Cu-Al intermetallics regions were found in the thermal aging samples. The thickness of Cu-Al intermetallics is growing linearly with the temperature as the diffusion rate increases in higher temperature. The Cu-Al bond is weak compare to Au-Al in accordance with aging through wire pull test. 2024-12-13T07:02:01Z 2024-12-13T07:02:01Z 2011 Resource Types::text::Final Year Project https://irepository.uniten.edu.my/handle/123456789/35331 en application/pdf |
| spellingShingle | Copper wire Ooi Xin Yi Improvement of cu-al bond integrity on low k pad structures |
| title | Improvement of cu-al bond integrity on low k pad structures |
| title_full | Improvement of cu-al bond integrity on low k pad structures |
| title_fullStr | Improvement of cu-al bond integrity on low k pad structures |
| title_full_unstemmed | Improvement of cu-al bond integrity on low k pad structures |
| title_short | Improvement of cu-al bond integrity on low k pad structures |
| title_sort | improvement of cu-al bond integrity on low k pad structures |
| topic | Copper wire |
| url_provider | http://dspace.uniten.edu.my/ |