Analysis of Transmission Performance for Fine Pitch Interconnect
Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there are very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires...
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Trans Tech Publications Ltd
2024
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| author | Leong H.Y. Yap B.K. Chin L.P. Zuraida E.E. Awang Mat Z. |
| author2 | 55787052600 |
| author_facet | 55787052600 Leong H.Y. Yap B.K. Chin L.P. Zuraida E.E. Awang Mat Z. |
| author_sort | Leong H.Y. |
| building | UNITEN Library |
| collection | Institutional Repository |
| content_provider | Universiti Tenaga Nasional |
| content_source | UNITEN Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there are very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires. This paper investigated the transmission performance of single bare bonding wires and insulated bonding wires with different wire material, wire diameter, bonding height and insulation thickness at high frequency. The simulation analysis shows that when the frequency increases above 15 Ghz, the effect of geometric parameters has no significant difference to the transmission performance. The thickness of the insulation between 0.1 ?m to 0.3 ?m demonstrated similar performance for return loss and insertion loss across all frequencies. � 2023 Trans Tech Publications Ltd, Switzerland. |
| format | Book chapter |
| id | my.uniten.dspace-34596 |
| institution | Universiti Tenaga Nasional |
| publishDate | 2024 |
| publisher | Trans Tech Publications Ltd |
| record_format | dspace |
| spelling | my.uniten.dspace-345962024-10-14T11:20:57Z Analysis of Transmission Performance for Fine Pitch Interconnect Leong H.Y. Yap B.K. Chin L.P. Zuraida E.E. Awang Mat Z. 55787052600 26649255900 58310807100 58311394500 57197760538 electrical performance fine pitch interconnect insulated Cu wire signal transmission Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there are very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires. This paper investigated the transmission performance of single bare bonding wires and insulated bonding wires with different wire material, wire diameter, bonding height and insulation thickness at high frequency. The simulation analysis shows that when the frequency increases above 15 Ghz, the effect of geometric parameters has no significant difference to the transmission performance. The thickness of the insulation between 0.1 ?m to 0.3 ?m demonstrated similar performance for return loss and insertion loss across all frequencies. � 2023 Trans Tech Publications Ltd, Switzerland. Final 2024-10-14T03:20:57Z 2024-10-14T03:20:57Z 2023 Book chapter 10.4028/p-6dh4yu 2-s2.0-85161723093 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85161723093&doi=10.4028%2fp-6dh4yu&partnerID=40&md5=eb8eb150bbc1280e1e867b5ce3429945 https://irepository.uniten.edu.my/handle/123456789/34596 343 67 72 Trans Tech Publications Ltd Scopus |
| spellingShingle | electrical performance fine pitch interconnect insulated Cu wire signal transmission Leong H.Y. Yap B.K. Chin L.P. Zuraida E.E. Awang Mat Z. Analysis of Transmission Performance for Fine Pitch Interconnect |
| title | Analysis of Transmission Performance for Fine Pitch Interconnect |
| title_full | Analysis of Transmission Performance for Fine Pitch Interconnect |
| title_fullStr | Analysis of Transmission Performance for Fine Pitch Interconnect |
| title_full_unstemmed | Analysis of Transmission Performance for Fine Pitch Interconnect |
| title_short | Analysis of Transmission Performance for Fine Pitch Interconnect |
| title_sort | analysis of transmission performance for fine pitch interconnect |
| topic | electrical performance fine pitch interconnect insulated Cu wire signal transmission |
| url_provider | http://dspace.uniten.edu.my/ |