An in-depth study of lead frame tape residue in quad flat non-leaded package
TK7872.T55 S57 2019
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| Format: | text::Final Year Project |
| Language: | en |
| Published: |
2024
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| _version_ | 1839753754224623616 |
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| author | Shri Kumaran Nadaraja |
| author_facet | Shri Kumaran Nadaraja |
| author_sort | Shri Kumaran Nadaraja |
| building | UNITEN Library |
| collection | Institutional Repository |
| content_provider | Universiti Tenaga Nasional |
| content_source | UNITEN Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | TK7872.T55 S57 2019 |
| format | Resource Types::text::Final Year Project |
| id | my.uniten.dspace-32479 |
| institution | Universiti Tenaga Nasional |
| language | en |
| publishDate | 2024 |
| record_format | dspace |
| spelling | my.uniten.dspace-324792025-07-31T15:35:27Z An in-depth study of lead frame tape residue in quad flat non-leaded package Shri Kumaran Nadaraja Thin film devices Integrated circuits TK7872.T55 S57 2019 Lead frame tape is crucial in the manufacturing of semiconductor integrated circuits (IC) as it acts as a support to the backside of the lead frame during the IC assembly process. The occurrence of Quad Flat Non-Leaded (QFN) tape residue is critical as affected IC units that are produced are of low reliability and fail electrical conductivity tests. This will influence overall performance of the chips and will contribute to a low pass yield as there are rejected units in the manufacturing industry. The occurrence of tape residue is studied by conducting an experiment using lead frame and tapes by three manufacturers with two die bond adhesives. Basic copper (Cu) wire bonding performances and die bonding performances are measured in terms of process capability, stitch bond strength and die attach strength are also discussed in this thesis to understand process limitations and challenges. The results are then compiled and analyzed to find a suitable combination of materials as a solution. Thermoplastic adhesive-based lead frame tape manufactured by Hitachi has no tape residue after de- taping in Mid-End Process. 2024-05-30T12:59:04Z 2024-05-30T12:59:04Z 2019 Resource Types::text::Final Year Project https://irepository.uniten.edu.my/handle/123456789/32479 en application/pdf |
| spellingShingle | Thin film devices Integrated circuits Shri Kumaran Nadaraja An in-depth study of lead frame tape residue in quad flat non-leaded package |
| title | An in-depth study of lead frame tape residue in quad flat non-leaded package |
| title_full | An in-depth study of lead frame tape residue in quad flat non-leaded package |
| title_fullStr | An in-depth study of lead frame tape residue in quad flat non-leaded package |
| title_full_unstemmed | An in-depth study of lead frame tape residue in quad flat non-leaded package |
| title_short | An in-depth study of lead frame tape residue in quad flat non-leaded package |
| title_sort | in-depth study of lead frame tape residue in quad flat non-leaded package |
| topic | Thin film devices Integrated circuits |
| url_provider | http://dspace.uniten.edu.my/ |