APA (7th ed.) Citation

H.Y, L., F.Z, M., M.R, I., W.B, K., N, K., Y.B, K., . . . 55787052600. (2023). Development of insulated Cu wire ball bonding.

Chicago Style (17th ed.) Citation

H.Y, Leong, Mohd F.Z, Ibrahim M.R, Kid W.B, Khan N, Kar Y.B, Tan L.C, and 55787052600. Development of Insulated Cu Wire Ball Bonding. 2023.

MLA (9th ed.) Citation

H.Y, Leong, et al. Development of Insulated Cu Wire Ball Bonding. 2023.