APA (7th ed.) Citation

Y.B, K., N.A, T., Z, S., J.S, F., V, R., & 26649255900. (2023). Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS.

Chicago Style (17th ed.) Citation

Y.B, Kar, Talik N.A, Sauli Z, Fei J.S, Retnasamy V, and 26649255900. Finite Element Analysis of Thermal Distributions of Solder Ball in Flip Chip Ball Grid Array Using ABAQUS. 2023.

MLA (9th ed.) Citation

Y.B, Kar, et al. Finite Element Analysis of Thermal Distributions of Solder Ball in Flip Chip Ball Grid Array Using ABAQUS. 2023.