Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging
Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject...
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2023
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| _version_ | 1833410649054511104 |
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| author | Shualdi W. Ahmad I. Omar G. Isnin A. |
| author2 | 36194999100 |
| author_facet | 36194999100 Shualdi W. Ahmad I. Omar G. Isnin A. |
| author_sort | Shualdi W. |
| building | UNITEN Library |
| collection | Institutional Repository |
| content_provider | Universiti Tenaga Nasional |
| content_source | UNITEN Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject to thermal aging are reported. The thicknesses of interfacial Ni-Cu-Sn IMC compounds were observed after exposed to 50, 100, 200, 400 and 800 hours aging time. The temperature for the thermal aging was kept constant at 175�C. It was noted that IMC layers grew in thickness as the thermal aging time increased. The highest IMC layer thickness was observed at 800 hours thermal aging time. At 800 hours aging time, the formation of voids was obvious and base metal-rich compound was also found at certain location probably due to grain boundary diffusion effect. |
| format | Conference paper |
| id | my.uniten.dspace-29720 |
| institution | Universiti Tenaga Nasional |
| publishDate | 2023 |
| record_format | dspace |
| spelling | my.uniten.dspace-297202023-12-28T15:41:47Z Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging Shualdi W. Ahmad I. Omar G. Isnin A. 36194999100 12792216600 11540084800 24338529400 Grain boundary diffusion Intermetallic compound (IMC) Thermal aging Voids Antimony compounds Diffusion Electronics packaging Grain boundaries Grain size and shape Lead Lead compounds Semiconducting intermetallics Silver Soldering alloys Thermal aging Aging time Base metals Electronic Packaging Grain-boundary diffusion IMC layer Intermetallic compound (IMC) Intermetallic compound growths Intermetallic compounds Intermetallic growth Lead free solders Power package Power packaging Solder joint reliability Tin Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject to thermal aging are reported. The thicknesses of interfacial Ni-Cu-Sn IMC compounds were observed after exposed to 50, 100, 200, 400 and 800 hours aging time. The temperature for the thermal aging was kept constant at 175�C. It was noted that IMC layers grew in thickness as the thermal aging time increased. The highest IMC layer thickness was observed at 800 hours thermal aging time. At 800 hours aging time, the formation of voids was obvious and base metal-rich compound was also found at certain location probably due to grain boundary diffusion effect. Final 2023-12-28T07:41:47Z 2023-12-28T07:41:47Z 2008 Conference paper 10.1109/IEMT.2008.5507783 2-s2.0-77955119406 https://www.scopus.com/inward/record.uri?eid=2-s2.0-77955119406&doi=10.1109%2fIEMT.2008.5507783&partnerID=40&md5=849770af6f9d10492abad77208ad0a93 https://irepository.uniten.edu.my/handle/123456789/29720 5507783 Scopus |
| spellingShingle | Grain boundary diffusion Intermetallic compound (IMC) Thermal aging Voids Antimony compounds Diffusion Electronics packaging Grain boundaries Grain size and shape Lead Lead compounds Semiconducting intermetallics Silver Soldering alloys Thermal aging Aging time Base metals Electronic Packaging Grain-boundary diffusion IMC layer Intermetallic compound (IMC) Intermetallic compound growths Intermetallic compounds Intermetallic growth Lead free solders Power package Power packaging Solder joint reliability Tin Shualdi W. Ahmad I. Omar G. Isnin A. Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging |
| title | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging |
| title_full | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging |
| title_fullStr | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging |
| title_full_unstemmed | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging |
| title_short | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging |
| title_sort | intermetallic growth of sn-ag-sb/ni plated cu in power packaging subject to thermal aging |
| topic | Grain boundary diffusion Intermetallic compound (IMC) Thermal aging Voids Antimony compounds Diffusion Electronics packaging Grain boundaries Grain size and shape Lead Lead compounds Semiconducting intermetallics Silver Soldering alloys Thermal aging Aging time Base metals Electronic Packaging Grain-boundary diffusion IMC layer Intermetallic compound (IMC) Intermetallic compound growths Intermetallic compounds Intermetallic growth Lead free solders Power package Power packaging Solder joint reliability Tin |
| url_provider | http://dspace.uniten.edu.my/ |