APA (7th ed.) Citation

W, S., B, B., I, A., G, O., A, I., & 36194999100. (2023). Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging.

Chicago Style (17th ed.) Citation

W, Shualdi, Bais B, Ahmad I, Omar G, Isnin A, and 36194999100. Nanoindentation Characterization of Sn-Ag-Sb/Cu Substrate IMC Layer Subject to Thermal Aging. 2023.

MLA (9th ed.) Citation

W, Shualdi, et al. Nanoindentation Characterization of Sn-Ag-Sb/Cu Substrate IMC Layer Subject to Thermal Aging. 2023.