APA (7th ed.) Citation

M.A, A., M.Z, A., M.S.A, A., R, K., M.S, R., M.H.H, I., . . . 57527077400. (2023). Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging. Springer Science and Business Media Deutschland GmbH.

Chicago Style (17th ed.) Citation

M.A, Alim, Abdullah M.Z, Aziz M.S.A, Kamarudin R, Rusdi M.S, Ishak M.H.H, Gunnasegaran P, and 57527077400. Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging. Springer Science and Business Media Deutschland GmbH, 2023.

MLA (9th ed.) Citation

M.A, Alim, et al. Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging. Springer Science and Business Media Deutschland GmbH, 2023.