Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures

This paper investigates the impact of the high-K material gate spacer on short channel effects (SCEs) for the 16 nm double-gate FinFET (DG-FinFET), where depletion-layer widths of the source-drain corresponds to the channel length. Virtual fabrication process along with design modification throughou...

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Main Authors: Roslan A.F., Salehuddin F., Zain A.S.M., Kaharudin K.E., Ahmad I., Hazura H., Hanim A.R., Idris S.K.
Other Authors: 57203514087
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Published: Institute of Advanced Engineering and Science 2023
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author Roslan A.F.
Salehuddin F.
Zain A.S.M.
Kaharudin K.E.
Ahmad I.
Hazura H.
Hanim A.R.
Idris S.K.
author2 57203514087
author_facet 57203514087
Roslan A.F.
Salehuddin F.
Zain A.S.M.
Kaharudin K.E.
Ahmad I.
Hazura H.
Hanim A.R.
Idris S.K.
author_sort Roslan A.F.
building UNITEN Library
collection Institutional Repository
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
continent Asia
country Malaysia
description This paper investigates the impact of the high-K material gate spacer on short channel effects (SCEs) for the 16 nm double-gate FinFET (DG-FinFET), where depletion-layer widths of the source-drain corresponds to the channel length. Virtual fabrication process along with design modification throughout the study and its electrical characterization is implemented and significant improvement is shown towards the altered structure design whereby in terms of the ratio of drive current against the leakage current (ION/IOFF ratio), all three materials tested being S3N4, HfO2 and TiO2 increases from the respective 60.90, 80.70 and 84.77 to 84.77, 91.54 and 92.69. That being said, the incremental in ratio has satisfied the incremental on the drive current as well as decreases the leakage current. Threshold voltage (VTH) for all dielectric materials have also satisfy the minimum requirement predicted by the International Technology Roadmap Semiconductor (ITRS) 2013 for which is at 0.461�12.7% V. Based on the results obtained, the high-K materials have shown a significant improvement, specifically after the modifications towards the Source/Drain. Compared to the initial design made, TiO2 has improved by 12.94% after the alteration made in terms of the overall ION and IOFF performances through the ION/IOFF ratio value obtained, as well as meeting the required value for VTH obtained at 0.464V. The ION from high-K materials has proved to meet the minimum requirement by ITRS 2013 for low performance Multi-Gate technology. � 2019 Institute of Advanced Engineering and Science. All rights reserved.
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spelling my.uniten.dspace-246852023-05-29T15:25:50Z Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures Roslan A.F. Salehuddin F. Zain A.S.M. Kaharudin K.E. Ahmad I. Hazura H. Hanim A.R. Idris S.K. 57203514087 36239165300 55925762500 56472706900 12792216600 35108985200 57193616206 57202632295 This paper investigates the impact of the high-K material gate spacer on short channel effects (SCEs) for the 16 nm double-gate FinFET (DG-FinFET), where depletion-layer widths of the source-drain corresponds to the channel length. Virtual fabrication process along with design modification throughout the study and its electrical characterization is implemented and significant improvement is shown towards the altered structure design whereby in terms of the ratio of drive current against the leakage current (ION/IOFF ratio), all three materials tested being S3N4, HfO2 and TiO2 increases from the respective 60.90, 80.70 and 84.77 to 84.77, 91.54 and 92.69. That being said, the incremental in ratio has satisfied the incremental on the drive current as well as decreases the leakage current. Threshold voltage (VTH) for all dielectric materials have also satisfy the minimum requirement predicted by the International Technology Roadmap Semiconductor (ITRS) 2013 for which is at 0.461�12.7% V. Based on the results obtained, the high-K materials have shown a significant improvement, specifically after the modifications towards the Source/Drain. Compared to the initial design made, TiO2 has improved by 12.94% after the alteration made in terms of the overall ION and IOFF performances through the ION/IOFF ratio value obtained, as well as meeting the required value for VTH obtained at 0.464V. The ION from high-K materials has proved to meet the minimum requirement by ITRS 2013 for low performance Multi-Gate technology. � 2019 Institute of Advanced Engineering and Science. All rights reserved. Final 2023-05-29T07:25:50Z 2023-05-29T07:25:50Z 2019 Article 10.11591/ijeecs.v14.i2.pp573-580 2-s2.0-85062500017 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85062500017&doi=10.11591%2fijeecs.v14.i2.pp573-580&partnerID=40&md5=66932be9b591b05e7117add38a1d340f https://irepository.uniten.edu.my/handle/123456789/24685 14 2 573 580 All Open Access, Hybrid Gold Institute of Advanced Engineering and Science Scopus
spellingShingle Roslan A.F.
Salehuddin F.
Zain A.S.M.
Kaharudin K.E.
Ahmad I.
Hazura H.
Hanim A.R.
Idris S.K.
Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures
title Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures
title_full Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures
title_fullStr Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures
title_full_unstemmed Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures
title_short Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures
title_sort comparative high-k material gate spacer impact in dg-finfet parameter variations between two structures
url_provider http://dspace.uniten.edu.my/