APA (7th ed.) Citation

K.W, S., K.Y, Y., C, L., Y.B, K., H, M., & 35796107300. (2023). Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer. Institute of Electrical and Electronics Engineers Inc.

Chicago Style (17th ed.) Citation

K.W, Shi, Yow K.Y, Lo C, Kar Y.B, Misran H, and 35796107300. Multi Beam Laser Grooving Process Parameter Development and Die Strength Characterization for 40nm Node Low-K/ULK Wafer. Institute of Electrical and Electronics Engineers Inc, 2023.

MLA (9th ed.) Citation

K.W, Shi, et al. Multi Beam Laser Grooving Process Parameter Development and Die Strength Characterization for 40nm Node Low-K/ULK Wafer. Institute of Electrical and Electronics Engineers Inc, 2023.