Insulated Cu wire free air ball characterization
Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 ?m insula...
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Elsevier Ltd
2023
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| author | Leong H. Yap B. Khan N. Ibrahim M.R. Tan L.C. |
| author2 | 55787052600 |
| author_facet | 55787052600 Leong H. Yap B. Khan N. Ibrahim M.R. Tan L.C. |
| author_sort | Leong H. |
| building | UNITEN Library |
| collection | Institutional Repository |
| content_provider | Universiti Tenaga Nasional |
| content_source | UNITEN Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 ?m insulated Cu wire were investigated using SEM, FESEM and FTIR surface analysis. The results were compared with that of bare Cu wire. Consistently spherical residue free FAB of insulated Cu wire were formed using forming gas. The samples with insulated Cu wire consistently produced larger FAB than that of bare Cu wire, indicating that the energy required for free air ball formation is lower. Basic bonding performances in terms of ball bond strength, intermetallic (IMC) coverage growth and stitch bond strength of insulated Cu wire at time zero are also discussed in the paper. © 2014 Elsevier Ltd. All rights. |
| format | Article |
| id | my.uniten.dspace-22061 |
| institution | Universiti Tenaga Nasional |
| publishDate | 2023 |
| publisher | Elsevier Ltd |
| record_format | dspace |
| spelling | my.uniten.dspace-220612023-05-16T10:47:03Z Insulated Cu wire free air ball characterization Leong H. Yap B. Khan N. Ibrahim M.R. Tan L.C. 55787052600 26649255900 9736201900 16021986000 57661553500 Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 ?m insulated Cu wire were investigated using SEM, FESEM and FTIR surface analysis. The results were compared with that of bare Cu wire. Consistently spherical residue free FAB of insulated Cu wire were formed using forming gas. The samples with insulated Cu wire consistently produced larger FAB than that of bare Cu wire, indicating that the energy required for free air ball formation is lower. Basic bonding performances in terms of ball bond strength, intermetallic (IMC) coverage growth and stitch bond strength of insulated Cu wire at time zero are also discussed in the paper. © 2014 Elsevier Ltd. All rights. Final 2023-05-16T02:47:03Z 2023-05-16T02:47:03Z 2014 Article 10.1016/j.microrel.2014.03.015 2-s2.0-84905909926 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84905909926&doi=10.1016%2fj.microrel.2014.03.015&partnerID=40&md5=b4f29a47a122c65783794b7d74456473 https://irepository.uniten.edu.my/handle/123456789/22061 54 8 1567 1574 Elsevier Ltd Scopus |
| spellingShingle | Leong H. Yap B. Khan N. Ibrahim M.R. Tan L.C. Insulated Cu wire free air ball characterization |
| title | Insulated Cu wire free air ball characterization |
| title_full | Insulated Cu wire free air ball characterization |
| title_fullStr | Insulated Cu wire free air ball characterization |
| title_full_unstemmed | Insulated Cu wire free air ball characterization |
| title_short | Insulated Cu wire free air ball characterization |
| title_sort | insulated cu wire free air ball characterization |
| url_provider | http://dspace.uniten.edu.my/ |