APA (7th ed.) Citation

Li-Ngee, H., Hiroshi, N., Tadashi, T., & holingee@yahoo.com. (2010). Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives. Universiti Malaysia Perlis.

Chicago Style (17th ed.) Citation

Li-Ngee, Ho, Nishikawa Hiroshi, Takemoto Tadashi, and holingee@yahoo.com. Electrical Properties and Thermal Stability of Cu-P Containing Electrically Conductive Adhesives. Universiti Malaysia Perlis, 2010.

MLA (9th ed.) Citation

Li-Ngee, Ho, et al. Electrical Properties and Thermal Stability of Cu-P Containing Electrically Conductive Adhesives. Universiti Malaysia Perlis, 2010.

Warning: These citations may not always be 100% accurate.