Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component

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Bibliographic Details

Main Author:	Tan, Chun Huat
Other Authors:	Dr. Muhammad Iqbal Hussain
Format:	Learning Object
Language:	en
Published:	Universiti Malaysia Perlis (UniMAP) 2014
Subjects:	Printed circuit board assembly (PCBA) Manufacturing process Ball grid array (BGA)
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912
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