APA (7th ed.) Citation

Arshad, M. K. M., Hashim, U., & Isa, M. (2008). Under Bump Metallurgy (UBM)-a technology review for flip chip packaging. Department of Mechanical Engineering, University Malaya.

Chicago Style (17th ed.) Citation

Arshad, Mohd Khairuddin Md, Uda Hashim, and Muzamir Isa. Under Bump Metallurgy (UBM)-a Technology Review for Flip Chip Packaging. Department of Mechanical Engineering, University Malaya, 2008.

MLA (9th ed.) Citation

Arshad, Mohd Khairuddin Md, et al. Under Bump Metallurgy (UBM)-a Technology Review for Flip Chip Packaging. Department of Mechanical Engineering, University Malaya, 2008.