Ho, L. N., Nishikawa, H., & holingee@yahoo.com. (2013). Surfactant-free synthesis of copper particles for electrically conductive adhesive applications. TMS.
Chicago Style (17th ed.) CitationHo, Li Ngee, Hiroshi Nishikawa, and holingee@yahoo.com. Surfactant-free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications. TMS, 2013.
MLA (9th ed.) CitationHo, Li Ngee, et al. Surfactant-free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications. TMS, 2013.
Warning: These citations may not always be 100% accurate.