APA (7th ed.) Citation

Mazlan, M., Rahim, A., Mohd Mustafa Al Bakri, A., Muhammad Iqbal, A., Mohd Huzaifah, Y., Fathinul Najib, A. S., & mazlan547@ppinang.uitm.edu.my. (2013). Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application. Trans Tech Publications.

Chicago Style (17th ed.) Citation

Mazlan, Mohamed, Atan Rahim, Abdullah Mohd Mustafa Al Bakri, Ahmad Muhammad Iqbal, Yusoff Mohd Huzaifah, Ahmad Saad Fathinul Najib, and mazlan547@ppinang.uitm.edu.my. Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nano-silver in Semiconductor and Electronic Component Application. Trans Tech Publications, 2013.

MLA (9th ed.) Citation

Mazlan, Mohamed, et al. Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nano-silver in Semiconductor and Electronic Component Application. Trans Tech Publications, 2013.