Li-Ngee, H., Nishikawa, H., Takemoto, T., & holingee@yahoo.com. (2011). Effect of different copper fillers on the electrical resistivity of conductive adhesives. Springer Science+Business Media, LLC.
Chicago Style (17th ed.) CitationLi-Ngee, Ho, Hiroshi Nishikawa, Tadashi Takemoto, and holingee@yahoo.com. Effect of Different Copper Fillers on the Electrical Resistivity of Conductive Adhesives. Springer Science+Business Media, LLC, 2011.
MLA (9th ed.) CitationLi-Ngee, Ho, et al. Effect of Different Copper Fillers on the Electrical Resistivity of Conductive Adhesives. Springer Science+Business Media, LLC, 2011.
Warning: These citations may not always be 100% accurate.