Lin-Ngee, H., Teng, F. W., Nishikawa, H., Takemoto, T., Miyake, K., Fujita, M., . . . holingee@yahoo.com. (2011). Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives. Springer.
Chicago Style (17th ed.) CitationLin-Ngee, Ho, Fei Wu Teng, Hiroshi Nishikawa, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, Koyu Ota, and holingee@yahoo.com. Electrical Reliability of Different Alloying Content on Copper Alloy Fillers in Electrically Conductive Adhesives. Springer, 2011.
MLA (9th ed.) CitationLin-Ngee, Ho, et al. Electrical Reliability of Different Alloying Content on Copper Alloy Fillers in Electrically Conductive Adhesives. Springer, 2011.
Warning: These citations may not always be 100% accurate.