Li, Y., Ling, T., & Chia, R. C. J. (2024). On the dynamics of matching between issuers and reputable underwriters in the chinese international bond market. Journal of Propulsion Technology.
Chicago Style (17th ed.) CitationLi, Yuexia, Tai-Hu Ling, and Ricky Chee Jiun Chia. On the Dynamics of Matching Between Issuers and Reputable Underwriters in the Chinese International Bond Market. Journal of Propulsion Technology, 2024.
MLA (9th ed.) CitationLi, Yuexia, et al. On the Dynamics of Matching Between Issuers and Reputable Underwriters in the Chinese International Bond Market. Journal of Propulsion Technology, 2024.
Warning: These citations may not always be 100% accurate.