APA (7th ed.) Citation

Du, W., Hou, K., Xu, X., Saad, I., Hsien, W. L. Y., Hongen, A., . . . Hongfu, W. (2024). Evolution mechanism of rapid solidification microstructure of an undercooled copper-based single phase alloy. Journal of Materials Research and Technology.

Chicago Style (17th ed.) Citation

Du, Wenhua, Kai Hou, Xuguang Xu, Ismal Saad, Willey Liew Yun Hsien, AN Hongen, Nancy Julius Siambun, Bih-Lii Chuab, and Wang Hongfu. Evolution Mechanism of Rapid Solidification Microstructure of an Undercooled Copper-based Single Phase Alloy. Journal of Materials Research and Technology, 2024.

MLA (9th ed.) Citation

Du, Wenhua, et al. Evolution Mechanism of Rapid Solidification Microstructure of an Undercooled Copper-based Single Phase Alloy. Journal of Materials Research and Technology, 2024.