Sorimpuk, N. P., Wai, H. C., & Chua, B. (2022). Thermoforming characteristics of PLA/TPU multi-material specimens fabricated with fused deposition modelling under different temperatures. MDPI.
Chicago Style (17th ed.) CitationSorimpuk, Neilson Peter, Heng Choong Wai, and Bih-Lii Chua. Thermoforming Characteristics of PLA/TPU Multi-material Specimens Fabricated with Fused Deposition Modelling Under Different Temperatures. MDPI, 2022.
MLA (9th ed.) CitationSorimpuk, Neilson Peter, et al. Thermoforming Characteristics of PLA/TPU Multi-material Specimens Fabricated with Fused Deposition Modelling Under Different Temperatures. MDPI, 2022.
Warning: These citations may not always be 100% accurate.