Effect of Multiple Reflow on IMC Formation using Various Surface Finishes
In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMCs) formation of solder joints made from lead–free Sn–4Ag–0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG)...
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| Format: | Article |
| Language: | en |
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Inderscience Enterprises Ltd.
2013
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| Online Access: | http://umpir.ump.edu.my/id/eprint/5208/1/fkm-2013-aisha-EffectOfMultiple.pdf http://umpir.ump.edu.my/id/eprint/5208/ http://inderscience.metapress.com/content/3312812402860081/fulltext.pdf |
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| _version_ | 1831521738681221120 |
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| author | Siti Rabiatull Aisha, Idris Ali, Ourdjini |
| author_facet | Siti Rabiatull Aisha, Idris Ali, Ourdjini |
| author_sort | Siti Rabiatull Aisha, Idris |
| building | UMPSA Library |
| collection | Institutional Repository |
| content_provider | Universiti Malaysia Pahang Al-Sultan Abdullah |
| content_source | UMPSA Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMCs) formation of solder joints made from lead–free Sn–4Ag–0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG), immersion silver (ImAg) and copper surface finishes are presented. After the first reflow soldering, the well–known intermetallic Cu6Sn5 was observed in ImAg and Copper of surface finishes. While for ENEPIG and ENIG, mainly, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was formed respectively. By increasing the number of reflows up to three, the thickness of intermetallics increased gradually and their grain sizes coarsened. The intermetallics growth kinetics showed that the interfacial phase Cu6Sn5, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was controlled mainly by grain boundary diffusion and that the intermetallic growth on ENEPIG was found to be slowest among other surface finishes being used. |
| format | Article |
| id | my.ump.umpir.5208 |
| institution | Universiti Malaysia Pahang |
| language | en |
| publishDate | 2013 |
| publisher | Inderscience Enterprises Ltd. |
| record_format | eprints |
| spelling | my.ump.umpir.52082018-01-15T07:53:00Z http://umpir.ump.edu.my/id/eprint/5208/ Effect of Multiple Reflow on IMC Formation using Various Surface Finishes Siti Rabiatull Aisha, Idris Ali, Ourdjini T Technology (General) TA Engineering (General). Civil engineering (General) In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMCs) formation of solder joints made from lead–free Sn–4Ag–0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG), immersion silver (ImAg) and copper surface finishes are presented. After the first reflow soldering, the well–known intermetallic Cu6Sn5 was observed in ImAg and Copper of surface finishes. While for ENEPIG and ENIG, mainly, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was formed respectively. By increasing the number of reflows up to three, the thickness of intermetallics increased gradually and their grain sizes coarsened. The intermetallics growth kinetics showed that the interfacial phase Cu6Sn5, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was controlled mainly by grain boundary diffusion and that the intermetallic growth on ENEPIG was found to be slowest among other surface finishes being used. Inderscience Enterprises Ltd. 2013 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/5208/1/fkm-2013-aisha-EffectOfMultiple.pdf Siti Rabiatull Aisha, Idris and Ali, Ourdjini (2013) Effect of Multiple Reflow on IMC Formation using Various Surface Finishes. International Journal of Microstructure and Materials Properties, 7 (6). pp. 502-516. ISSN 1741-8410 (print); 1741-8429 (online). (Published) http://inderscience.metapress.com/content/3312812402860081/fulltext.pdf |
| spellingShingle | T Technology (General) TA Engineering (General). Civil engineering (General) Siti Rabiatull Aisha, Idris Ali, Ourdjini Effect of Multiple Reflow on IMC Formation using Various Surface Finishes |
| title | Effect of Multiple Reflow on IMC Formation using Various Surface Finishes |
| title_full | Effect of Multiple Reflow on IMC Formation using Various Surface Finishes |
| title_fullStr | Effect of Multiple Reflow on IMC Formation using Various Surface Finishes |
| title_full_unstemmed | Effect of Multiple Reflow on IMC Formation using Various Surface Finishes |
| title_short | Effect of Multiple Reflow on IMC Formation using Various Surface Finishes |
| title_sort | effect of multiple reflow on imc formation using various surface finishes |
| topic | T Technology (General) TA Engineering (General). Civil engineering (General) |
| url | http://umpir.ump.edu.my/id/eprint/5208/1/fkm-2013-aisha-EffectOfMultiple.pdf http://umpir.ump.edu.my/id/eprint/5208/ http://inderscience.metapress.com/content/3312812402860081/fulltext.pdf |
| url_provider | http://umpir.ump.edu.my/ |