Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates...
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| Language: | en |
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Trans Tech Publications, Switzerland
2014
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| Online Access: | http://umpir.ump.edu.my/id/eprint/5201/1/AMR.845.76_%28mimec2013%29_kak_ija_for_skt2014.pdf http://umpir.ump.edu.my/id/eprint/5201/ http://dx.doi.org/10.4028/www.scientific.net/AMR.845.76 |
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| author | Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Astuty, Amrin |
| author_facet | Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Astuty, Amrin |
| author_sort | Siti Rabiatull Aisha, Idris |
| building | UMPSA Library |
| collection | Institutional Repository |
| content_provider | Universiti Malaysia Pahang Al-Sultan Abdullah |
| content_source | UMPSA Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | The electronic packaging industry is now being driven towards smaller, lighter, and
thinner electronic products but with higher performance and more functions. Thus, smaller solder
ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study
investigates the interfacial reactions during reflow soldering and isothermal aging between Sn4.0Ag-0.5Cu
(SAC405) and electroless nickel (boron)/ immersion palladium/immersion gold
(EN(B)EPIG). Reliability of solder joint has also been investigated by performing solid state
isothermal aging at 125˚C for up to 2000 hours. The results revealed that after reflow soldering, (Cu,
Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment another IMC was
found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time of solder joints
resulted in an increase in IMC thickness and a change in morphology into more spherical, dense and
with larger grain size. By using optical microscope, the average thickness of the intermetallics was
measured and it found that the larger solder balls produced thicker IMC than the smaller solder balls
during reflow soldering. However, after aging the smaller solders produced thicker IMC than the
larger solders.
|
| format | Article |
| id | my.ump.umpir.5201 |
| institution | Universiti Malaysia Pahang |
| language | en |
| publishDate | 2014 |
| publisher | Trans Tech Publications, Switzerland |
| record_format | eprints |
| spelling | my.ump.umpir.52012018-01-15T07:48:19Z http://umpir.ump.edu.my/id/eprint/5201/ Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Astuty, Amrin T Technology (General) TN Mining engineering. Metallurgy The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn4.0Ag-0.5Cu (SAC405) and electroless nickel (boron)/ immersion palladium/immersion gold (EN(B)EPIG). Reliability of solder joint has also been investigated by performing solid state isothermal aging at 125˚C for up to 2000 hours. The results revealed that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment another IMC was found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time of solder joints resulted in an increase in IMC thickness and a change in morphology into more spherical, dense and with larger grain size. By using optical microscope, the average thickness of the intermetallics was measured and it found that the larger solder balls produced thicker IMC than the smaller solder balls during reflow soldering. However, after aging the smaller solders produced thicker IMC than the larger solders. Trans Tech Publications, Switzerland 2014 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/5201/1/AMR.845.76_%28mimec2013%29_kak_ija_for_skt2014.pdf Siti Rabiatull Aisha, Idris and Saliza Azlina, Osman and Ali, Ourdjini and Astuty, Amrin (2014) Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish. Advanced Materials Research, 845. pp. 76-80. ISSN 1022-6680 (print), 1662-8985 (online). (Published) http://dx.doi.org/10.4028/www.scientific.net/AMR.845.76 DOI: http://dx.doi.org/10.4028/www.scientific.net/AMR.845.76 |
| spellingShingle | T Technology (General) TN Mining engineering. Metallurgy Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Astuty, Amrin Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish |
| title | Effect Of Solder Volume on Interfacial Reaction Between
SAC405 Solders and EN(B)EPIG Surface Finish |
| title_full | Effect Of Solder Volume on Interfacial Reaction Between
SAC405 Solders and EN(B)EPIG Surface Finish |
| title_fullStr | Effect Of Solder Volume on Interfacial Reaction Between
SAC405 Solders and EN(B)EPIG Surface Finish |
| title_full_unstemmed | Effect Of Solder Volume on Interfacial Reaction Between
SAC405 Solders and EN(B)EPIG Surface Finish |
| title_short | Effect Of Solder Volume on Interfacial Reaction Between
SAC405 Solders and EN(B)EPIG Surface Finish |
| title_sort | effect of solder volume on interfacial reaction between
sac405 solders and en(b)epig surface finish |
| topic | T Technology (General) TN Mining engineering. Metallurgy |
| url | http://umpir.ump.edu.my/id/eprint/5201/1/AMR.845.76_%28mimec2013%29_kak_ija_for_skt2014.pdf http://umpir.ump.edu.my/id/eprint/5201/ http://dx.doi.org/10.4028/www.scientific.net/AMR.845.76 |
| url_provider | http://umpir.ump.edu.my/ |