Subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation

Wood–plastic composites (WPCs) were prepared by polypropylene, wood flour, maleic anhydride-grafted polypropylene and pristine (Na+ montmorillonite)/TMI-modified nanoclay using extruder followed by injection moulding technique. The surface mechanical properties of the nanoclay-based WPC were investi...

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Main Authors: Yadav, Sumit Manohar, Kamal, Yusoh
Format: Article
Language:en
Published: Springer Verlag 2019
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Online Access:http://umpir.ump.edu.my/id/eprint/25421/1/Subsurface%20mechanical%20properties%20and%20subsurface%20creep%20behaviour%20of%20modified%20.pdf
http://umpir.ump.edu.my/id/eprint/25421/
https://doi.org/10.1007/s00289-018-2497-5
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author Yadav, Sumit Manohar
Kamal, Yusoh
author_facet Yadav, Sumit Manohar
Kamal, Yusoh
author_sort Yadav, Sumit Manohar
building UMPSA Library
collection Institutional Repository
content_provider Universiti Malaysia Pahang Al-Sultan Abdullah
content_source UMPSA Institutional Repository
continent Asia
country Malaysia
description Wood–plastic composites (WPCs) were prepared by polypropylene, wood flour, maleic anhydride-grafted polypropylene and pristine (Na+ montmorillonite)/TMI-modified nanoclay using extruder followed by injection moulding technique. The surface mechanical properties of the nanoclay-based WPC were investigated by means of nanoindentation technique. The results show that the hardness, elastic modulus and creep resistant of the WPC dramatically enhanced with the incorporation of nanoclay. This enhancement was dependent on the nanoclay content as well as the dispersion of nanoclay in the polymer matrix. At 1 wt% nanoclay content, the hardness, elastic modulus and creep resistant of pristine nanoclay-reinforced WPC (WPC/MMT) improved by approximately 35%, 30% and 15%, respectively, compared to WPC without nanoclay. For the TMI-modified nanoclay-based WPC (WPC/MMT Cu), the improvements in these properties were about 1.2, 1.5 and 1.5 times higher than the WPC/MMT. Viscoelastic model was applied to examine the effect of nanoclay loadings on the creep performance of the WPC. Results exhibited that the model was in good agreement with the experimental data. Incorporation of nanoclay leads to an increase in elastic deformation, especially in WPC/MMT Cu, and induces a higher initial displacement at the early stage of creep.
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spelling my.ump.umpir.254212019-10-25T04:06:27Z http://umpir.ump.edu.my/id/eprint/25421/ Subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation Yadav, Sumit Manohar Kamal, Yusoh QD Chemistry TP Chemical technology Wood–plastic composites (WPCs) were prepared by polypropylene, wood flour, maleic anhydride-grafted polypropylene and pristine (Na+ montmorillonite)/TMI-modified nanoclay using extruder followed by injection moulding technique. The surface mechanical properties of the nanoclay-based WPC were investigated by means of nanoindentation technique. The results show that the hardness, elastic modulus and creep resistant of the WPC dramatically enhanced with the incorporation of nanoclay. This enhancement was dependent on the nanoclay content as well as the dispersion of nanoclay in the polymer matrix. At 1 wt% nanoclay content, the hardness, elastic modulus and creep resistant of pristine nanoclay-reinforced WPC (WPC/MMT) improved by approximately 35%, 30% and 15%, respectively, compared to WPC without nanoclay. For the TMI-modified nanoclay-based WPC (WPC/MMT Cu), the improvements in these properties were about 1.2, 1.5 and 1.5 times higher than the WPC/MMT. Viscoelastic model was applied to examine the effect of nanoclay loadings on the creep performance of the WPC. Results exhibited that the model was in good agreement with the experimental data. Incorporation of nanoclay leads to an increase in elastic deformation, especially in WPC/MMT Cu, and induces a higher initial displacement at the early stage of creep. Springer Verlag 2019-05-01 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/25421/1/Subsurface%20mechanical%20properties%20and%20subsurface%20creep%20behaviour%20of%20modified%20.pdf Yadav, Sumit Manohar and Kamal, Yusoh (2019) Subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation. Polymer Bulletin, 76 (5). pp. 2179-2196. ISSN 0170-0839(Print); 1436-2449(Online). (Published) https://doi.org/10.1007/s00289-018-2497-5 https://doi.org/10.1007/s00289-018-2497-5
spellingShingle QD Chemistry
TP Chemical technology
Yadav, Sumit Manohar
Kamal, Yusoh
Subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation
title Subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation
title_full Subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation
title_fullStr Subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation
title_full_unstemmed Subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation
title_short Subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation
title_sort subsurface mechanical properties and subsurface creep behaviour of modified nanoclay-based wood–plastic composites studied by nanoindentation
topic QD Chemistry
TP Chemical technology
url http://umpir.ump.edu.my/id/eprint/25421/1/Subsurface%20mechanical%20properties%20and%20subsurface%20creep%20behaviour%20of%20modified%20.pdf
http://umpir.ump.edu.my/id/eprint/25421/
https://doi.org/10.1007/s00289-018-2497-5
https://doi.org/10.1007/s00289-018-2497-5
url_provider http://umpir.ump.edu.my/