APA (7th ed.) Citation

Yusoff, S., Mohamed, M., Ahmad, K., Abdullah, M., Mujeebu, M., Mohd Ali, Z., . . . Yaakob, Y. (2009). 3-D conjugate heat transfer analysis of PLCC packages mounted in-line on a Printed Circuit Board.

Chicago Style (17th ed.) Citation

Yusoff, S., M. Mohamed, K.A Ahmad, M.Z Abdullah, M.A Mujeebu, Z. Mohd Ali, F. Idrus, and Y. Yaakob. 3-D Conjugate Heat Transfer Analysis of PLCC Packages Mounted In-line on a Printed Circuit Board. 2009.

MLA (9th ed.) Citation

Yusoff, S., et al. 3-D Conjugate Heat Transfer Analysis of PLCC Packages Mounted In-line on a Printed Circuit Board. 2009.