A new invention of thermal pad using sol-gel nanosilver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver silica films were applied on PLCC using a sol-gel process and heat-treated...
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| Main Authors: | , , , , , |
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| Format: | Non-Indexed Article |
| Published: |
Trans-Tech Publication
2013
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| Online Access: | http://discol.umk.edu.my/id/eprint/7866/ http://dx.doi.org/10.4028/www.scientific.net/AMR.795.158 |
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