APA (7th ed.) Citation

Mohamed, M., Atan, R., Bakri, A. M. M. A., Ahmad, M. I., Yusoff, H. M., & Saad, F. A. J. (2012). Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application. Trans-Tech Publication.

Chicago Style (17th ed.) Citation

Mohamed, Mazlan, Rahim Atan, Abdullah Mohd Mustafa Al Bakri, Muhamad Iqbal Ahmad, Huzaifah Mohd Yusoff, and Fathinul Ahmad Jabib Saad. Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application. Trans-Tech Publication, 2012.

MLA (9th ed.) Citation

Mohamed, Mazlan, et al. Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application. Trans-Tech Publication, 2012.