APA (7th ed.) Citation

Haque, A., Lim, B., Haseeb, A. M. A., & Masjuki, H. H. (2012). Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame. Springer.

Chicago Style (17th ed.) Citation

Haque, A., B.H Lim, A.S. Md. Abdul Haseeb, and Haji Hassan Masjuki. Die Attach Properties of Zn-Al-Mg-Ga Based High-temperature Lead-free Solder on Cu Lead-frame. Springer, 2012.

MLA (9th ed.) Citation

Haque, A., et al. Die Attach Properties of Zn-Al-Mg-Ga Based High-temperature Lead-free Solder on Cu Lead-frame. Springer, 2012.

Warning: These citations may not always be 100% accurate.