APA (7th ed.) Citation

Haseeb, A. M. A., Arafat, M., & Johan, M. (2012). Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds.

Chicago Style (17th ed.) Citation

Haseeb, A.S. Md. Abdul, M.M Arafat, and M.R Johan. Stability of Molybdenum Nanoparticles in Sn-3.8Ag-0.7Cu Solder During Multiple Reflow and Their Influence on Interfacial Intermetallic Compounds. 2012.

MLA (9th ed.) Citation

Haseeb, A.S. Md. Abdul, et al. Stability of Molybdenum Nanoparticles in Sn-3.8Ag-0.7Cu Solder During Multiple Reflow and Their Influence on Interfacial Intermetallic Compounds. 2012.