Effects of addition of copper particles of different size to Sn-3.5Ag solder
In this study, copper particles with different sizes 20-30 nm, 3 and 10 mu m were incorporated into Sn-3.5Ag solder paste to form Sn-Ag-Cu composite solder. The Cu particles were added at 0.7 and 3 by paste mixing for 30 min. The composite solder samples were prepared on copper substrate at 240A deg...
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| Main Authors: | , |
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| Format: | Article |
| Published: |
Springer
2012
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/5450/ |
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